XCF128XFT64C
RoHS

XCF128XFT64C

XCF128XFT64C

Xilinx

Configuration Device 64-Pin FTBGA

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XCF128XFT64C

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Specification
MountSurface Mount
Width10mm
Length13mm
ECCN CodeEAR99
PackagingTray
Page Size4words
Pin Count64
Published2007
Ready/BusyYES
TechnologyCMOS
Toggle BitNO
Memory Size128Mb
Part StatusActive
Pbfree Codeno
RoHS StatusNon-RoHS Compliant
SubcategoryFlash Memories
Data PollingNO
Memory Width16
Organization8MX16
JESD-609 Codee0
Mounting TypeSurface Mount
Terminal FormBALL
Memory Density134217728 bit
Memory IC TypeFLASH
Number of Pins64
Package / Case64-TBGA
Power Supplies1.81.8/3.3V
Supply Voltage1.8V
Terminal Pitch1mm
Contact PlatingLead, Tin
Parallel/SerialPARALLEL
Terminal FinishTin/Lead (Sn63Pb37)
Base Part NumberXCF128X
Voltage - Supply1.7V~2V
Access Time (Max)85 ns
Factory Lead Time10 Weeks
Programmable TypeIn System Programmable
Terminal PositionBOTTOM
Supply Current-Max0.053mA
Height Seated (Max)1.2mm
Number of Functions1
Programming Voltage1.8V
Radiation HardeningNo
Standby Current-Max0.000075A
Operating Temperature-40°C~85°C
Command User InterfaceYES
Common Flash InterfaceYES
Number of Sectors/Size4127
Number of Terminations64
Supply Voltage-Max (Vsup)2V
Supply Voltage-Min (Vsup)1.7V
Peak Reflow Temperature (Cel)225
Moisture Sensitivity Level (MSL)3 (168 Hours)
Time@Peak Reflow Temperature-Max (s)30